Switch and method for manufacturing the same, and relay

A method for manufacturing a switch including a plurality of contacts that come into contact with and separate from each other, the method comprising:

• forming a mold portion of a predetermined pattern on an upper side of a substrate;
• growing a conductive layer in a thickness direction of the substrate in a plurality of regions excluding a region formed with the mold portion at the upper side of the substrate;
• removing the mold portion and having a surface in contact with a side surface of the mold portion of the conductive layer as contacting surfaces of the contacts;
• and
• dividing the substrate into plurals in accordance with the plurality of regions formed with the conductive layer.

A method for manufacturing a switch comprising:

• growing a plurality of layers, wherein the plurality of layers comprises a conductive layer, in a thickness direction of a substrate at an upper side of the substrate to form the plurality of layers on the upper side of the substrate;
• forming a mold portion of a predetermined pattern at an uppermost surface;
• etching the plurality of layers with the mold portion as a mask to divide the plurality of layers to a plurality of regions;
• forming a surface to become a contact from the etched surface of the conductive layer;
• performing isotropic etching on the surface of the substrate between the divided regions of the plurality of layers to form a recess at the surface of the substrate;
• performing anisotropic etching on the substrate between the divided regions of the plurality of layers to divide the substrate into plurals in accordance with the divided region of the plurality of layers;
• and
• etching a layer other than the conductive layer in at least one region of the divided regions to retreat an end face of the layer other than the conductive layer than a surface to become the contact of the conductive layer.

A method for manufacturing a switch comprising:

• forming a mold portion of a predetermined pattern on an upper side of a substrate and growing a plurality of layers, wherein the plurality of layers comprises a conductive layer, in a thickness direction of the substrate in a plurality of regions excluding a region where the mold portion is formed at the upper side of the substrate to form the plurality of layers on the upper side of the substrate;
• removing the mold portion and forming a surface to become a contact from a surface in contact with a side surface of the mold portion of the conductive layer;
• performing isotropic etching on the surface of the substrate between the separated regions of the plurality of layers to form a recess at the surface of the substrate;
• performing anisotropic etching on the substrate between the separated regions of the plurality of layers to divide the substrate into plurals in accordance with the separated region of the plurality of layers including the conductive layer;
• and
• etching a layer other than the contact layer in at least one region of the separated regions to retreat an end face of the layer other than the conductive layer than a surface to become the contact of the conductive layer.