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US 2011/0209908 A1Published application
Conductor package structure and method of the same
AssigneeAdvanced Chip Engineering Technology Inc.
InventorsDiann-Fang Lin, Yu-Shan Hu
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Abstract
The present invention provides a conductor package structure comprising a redistribution layer. An adhesive layer is formed on the redistribution layer. An electronic element is formed on the adhesive layer. Conductors are forming signal connection between the surface of a filling material and the bottom of the filling material, wherein the filling material is filled in the space between the electronic element and the conductors.
Claims18
A conductor package structure, comprising:
- a redistribution layer;
- an adhesive layer formed on said redistribution layer;
- at least one electronic element formed on said adhesive layer;
- and
- a plurality of conductors forming signal connection between the surface of a filling material and the bottom of said filling material, wherein said filling material is filled in the space between said plurality of conductors and around said electric element.
2 more elements
Dependencies are inferred from the claim text.