Liquid-repellent film former, method for forming liquid-repellent film, method for forming fine wiring using the same, and substrate comprising the same
AssigneeSamsung SDI Co., Ltd.
InventorsJong-Hee LEE, Kyu-Nam Joo, Young-su Kim, Jae-Myung Kim
Life of this patent
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Abstract
Disclosed are a liquid-repellent film former, a method for forming a liquid-repellent film, a method for forming fine wiring based on the same, and a printed circuit board including the same. The liquid-repellent film former includes a first coupling agent including a compound represented by the following Chemical Formula 1, a second coupling agent including a compound represented by the following Chemical Formula 2, and an alcohol solvent. Herein, the definitions of R1 to R8 are as described in the specification.
Claims19
A liquid-repellent film former, comprising:
- a first coupling agent including a compound represented by the following Chemical Formula 1;
- a second coupling agent including a compound represented by the following Chemical Formula 2;
- and
- an alcohol solvent:
- wherein, in the above Chemical Formula 1,
- R1 to R4 are the same or different and are independently substituted or unsubstituted C1 to C6 alkyl groups, and
- in the above Chemical Formula 2,
- R5 is a C1 to C6 alkyl group substituted with at least one fluorine (F), and
- R6 to R8 are the same or different, and are independently substituted or unsubstituted C1 to C6 alkyl groups.
A method for forming a liquid-repellent film, comprising:
- preparing a substrate;
- coating the substrate with a liquid-repellent film former that includes a first coupling agent containing a compound represented by the following Chemical Formula 1, a second coupling agent containing a compound represented by the following Chemical Formula 2, and an alcohol solvent;
- and
- drying the substrate coated with the liquid-repellent film former
- wherein, in the above Chemical Formula 1,
- R1 to R4 are the same or different and are independently substituted or unsubstituted C1 to C6 alkyl groups, and
- in the above Chemical Formula 2,
- R5 is a C1 to C6 alkyl group substituted with at least one fluorine (F), and
- R6 to R8 are the same or different, and are independently substituted or unsubstituted C1 to C6 alkyl groups.
A printed circuit board (PCB), comprising:
- a substrate;
- a liquid-repellent film that includes a first coupling agent containing a compound represented by the following Chemical Formula 1 and a second coupling agent containing a compound represented by the following Chemical Formula 2;
- and
- fine wiring formed on the liquid-repellent film:
- wherein, in the above Chemical Formula 1,
- R1 to R4 are the same or different and are independently substituted or unsubstituted C1 to C6 alkyl groups, and
- in the above Chemical Formula 2,
- R5 is a C1 to C6 alkyl group substituted with at least one fluorine (F), and
- R6 to R8 are the same or different, and are independently substituted or unsubstituted C1 to C6 alkyl groups.
Dependencies are inferred from the claim text.