US 2011/0209904 A1Published application

Wiring board and method for manufacturing the same

AssigneeIbiden Co., Ltd.

InventorsAtsushi ISHIDA, Ryojiro Tominaga, Kenji Sakai

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Abstract

A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Claims18

Dependent claims

A wiring board, comprising:

a substrate having a first surface and a second surface on an opposite side of the first surface, the substrate having a first penetrating hole penetrating through the substrate between the first surface and the second surface;
a first conductive circuit formed on the first surface of the substrate;
a second conductive circuit formed on the second surface of the substrate,
an interlayer insulation layer formed on the substrate and one of the first conductive circuit and the second conductive circuit;
and
a third conductive circuit formed on the interlayer insulation layer,
wherein the substrate has a first through-hole conductor connecting the first conductive circuit and the second conductive circuit and formed on an inner wall of the first penetrating hole, a filler filled inside the first through-hole conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, the second through-hole conductor comprises a conductive material filled in the second penetrating hole, the interlayer insulation layer has a via conductor formed in the interlayer insulation layer and electrically connecting the third conductive circuit and the second through-hole conductor, and the via conductor is positioned such that the via conductor is shifted from the center of the second through-hole conductor in a direction parallel to the first surface of the substrate.

4 more elements

A method for manufacturing a wiring board, comprising:

forming a first penetrating hole in a substrate such that the first penetrating hole penetrates through the substrate between a first surface of the substrate and a second surface of the substrate on an opposite side of the first substrate;
forming a first through-hole conductor on an inner wall of the first penetrating hole of the substrate;
forming a first conductive circuit on the first surface;
forming a second conductive circuit on the second surface of the substrate such that the second conductive circuit is connected to the first conductive circuit by the first through-hole conductor;
filling a filler inside the first through-hole conductor;
forming a second penetrating hole in the filler;
forming a second through-hole conductor by filling a conductive material in the second penetrating hole;
forming an interlayer insulation layer on the substrate and one of the first conductive circuit and the second conductive circuit;
forming a third conductive circuit on the interlayer insulation layer;
and
forming at a position shifted from the center of the second through-hole conductor in a direction parallel to the first surface of the substrate a via conductor in the interlayer insulation layer such that the second through-hole conductor and the third conductive circuit are connected by the via conductor.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/952,864Filed 23 Nov 2010
Priority: 26 Feb 2010
Published: 1 Sep 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

H05K 3/4038
Forming printed elements for providing electric connections to or between printed circuits: through-connections; Vertical interconnect access…
H05K 1/0222
Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors: for…
H05K 1/0231
Using auxiliary mounted passive components or auxiliary substances: capacitors or dielectric substances
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections