Cooling system for computer components

A component cooling apparatus, comprising:

• a first heat spreader 104 comprising a plate having a top side and a front face where the plate is shaped such that the front face is contoured to contact a top side of at least one component mounted on a component PC board 102;
• a heat pipe 106 coupled to the first heat spreader 104 along the top side of the first heat spreader 104, the heat pipe 106 having two ends;
• two cooling manifolds 200, where each of the cooling manifolds 200 comprises:
• a body 206 with a first end and a second end;
• a channel 320 formed into the body 206 and running between the first end of the body 206 and the second end of the body 206;
• a fluid inlet 202 attached to the first end of the body 206 and coupled to the channel 320;
• a fluid outlet 204 attached to the second end of the body 206 and coupled to the channel 320;
• at least one heat pipe clamp 210 configured to move between an open position and a closed position, the heat pipe clamp 210 configured to capture and hold one of the two ends of the heat pipe 106 against a top side of the body 206 when in the closed position.