Nozzle plate containing multiple micro-orifices for cascade impactor and method for manufacturing the same
AssigneeNational Chiao Tung University
InventorsChuen-Jinn Tsai, Sheng-Chieh Chen, Hong-Dar Chen
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Abstract
A nozzle plate containing multiple micro-orifices for the cascade impactor and a method for manufacturing the same are disclosed. The nozzle plate is formed by a series of semiconductor processes, including lithography, etching and electroplating. The nozzle plate comprises a plate body and a plurality of micro-orifices formed on the plate body. The orifice has a diameter which gradually expands in the direction away from the bottom of the plate body to achieve a smooth inner surface, allowing particles to pass therethrough smoothly without being clogged in the nozzle plate.
Claims7
A nozzle plate for a multi-stage cascade impactor, comprising:
- a plate body;
- and
- a plurality of micro-orifices formed on the said plate body and cutting through top and bottom sides of the said plate body, each said micro-orifice having a smooth inner surface and a diameter expanding gradually in direction from the bottom side of said the plate body toward the top side thereof.
A method for making a nozzle plate containing multiple micro-orifices, comprising the steps of:
- (1) depositing a seed layer on a substrate;
- (2) coating the said seed layer with a layer of first photoresist, radiating UV light through a first mask onto said first photoresist, and then developing the first photoresist;
- (3) etching said seed layer and removing the said first photoresist, so as to form a plurality of through holes on said seed layer that cut through top and bottom sides of said seed layer;
- (4) coating a sacrificial layer on said substrate and said seed layer;
- (5) depositing a metal mask film on said sacrificial layer;
- (6) coating a layer of second photoresist on the said metal mask film, radiating UV light through a second mask onto the said second photoresist, and then developing the second photoresist;
- (7) etching the said metal mask film and removing the said second photoresist, so as to form a plurality protrusions on the said sacrificial layer;
- (8) etching the said sacrificial layer until said substrate and the said seed layer are exposed to the outside;
- (9) electroplating a metal material onto the said seed layer;
- and
- (10) removing the said substrate, the said seed layer and the said sacrificial layer.
Dependencies are inferred from the claim text.