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US 2011/0179958 A1Published application
Substrate punch assembly
OwnerBruce JOHNSONinventor
Life of this patent
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Abstract
Substrate punch assembly, comprising a punch for perforating a substrate, a resilient element provided next to the punch, and a die arranged opposite to the punch for pressing against the substrate in the direction of the punch during a punch action, wherein the resilient element is configured to at least partly move with respect to the punch for pushing the substrate away from the punch when the punch moves away from the die.
Claims15
Substrate punch assembly, comprising
- a punch for perforating a substrate,
- a resilient element provided next to the punch, and
- a die arranged opposite to the punch for pressing against the substrate in the direction of the punch during a punch action, wherein
- the resilient element is configured to at least partly move with respect to the punch for pushing the substrate away from the punch when the punch moves away from the die.
1 more element
Method of punching a substrate, comprising
- moving a substrate for printing,
- punching the substrate with a punch,
- compressing a resilient element against the substrate, and
- retracting the punch from the substrate while the resilient element pushes the substrate away from the punch by expanding back to its original size.
1 more element
Print system, comprising
- a substrate guide mechanism for guiding the substrate along a curved path,
- a punch for punching a perforation in a curved portion of the substrate, and
- a die for receiving the punch,
- wherein the punch comprises a resilient element arranged to push the substrate in the direction of the die adjacent to the perforation.
1 more element
Dependencies are inferred from the claim text.