Semiconductor device and manufacturing method thereof
AssigneeToyota Jidosha Kabushiki Kaisha
InventorsTadashi MISUMI, Shinya IWASAKI, Takahide SUGIYAMA
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Abstract
A semiconductor device comprises a semiconductor substrate, a first electrode formed on a first main surface of the semiconductor substrate, and a second electrode formed on a second main surface of the semiconductor substrate. The semiconductor substrate includes a first region in which a density of oxygen-vacancy defects is greater than a density of vacancy cluster defects, and a second region in which the density of vacancy cluster defects is greater than the density of oxygen-vacancy defects.
Claims9
A semiconductor device comprising:
- a semiconductor substrate;
- a first electrode formed on a first main surface of the semiconductor substrate;
- and
- a second electrode formed on a second main surface of the semiconductor substrate,
- wherein the semiconductor substrate includes:
- a first region in which a density of oxygen-vacancy defects is greater than a density of vacancy cluster defects, and
- a second region in which the density of vacancy cluster defects is greater than the density of oxygen-vacancy defects.
A manufacturing method of a semiconductor device comprising a semiconductor substrate including a first region and a second region, wherein a density of oxygen-vacancy defects is greater than a density of vacancy cluster defects in the first region, and the density of vacancy cluster defects is greater than the density of oxygen-vacancy defects in the second region, the method comprising:
- introducing oxygen into the semiconductor substrate;
- and
- irradiating charged particles to a predetermined depth in the semiconductor substrate.
Dependencies are inferred from the claim text.