Apparatus and methods of forming memory lines and structures using double sidewall patterning for four times half pitch relief patterning
AssigneeSanDisk 3D LLC
InventorsRoy E. Scheuerlein, Yoichiro Tanaka
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AssigneeSanDisk 3D LLC
InventorsRoy E. Scheuerlein, Yoichiro Tanaka
Estimating the term…
The present invention provides apparatus, methods, and systems for fabricating memory lines and structures using double sidewall patterning for four times half pitch relief patterning. The invention includes forming features from a first template layer disposed above a substrate, forming half-pitch sidewall spacers adjacent the features, forming smaller features in a second template layer by using the half-pitch sidewall spacers as a hardmask, forming quarter-pitch sidewall spacers adjacent the smaller features, and forming conductor features from a conductor layer by using the quarter-pitch sidewall spacers as a hardmask. Numerous additional aspects are disclosed.
A method of forming a wiring pattern for a memory, comprising:
A wiring pattern for a memory array comprising:
A method of forming a wiring pattern for a memory, comprising:
A wiring pattern for a memory array comprising:
Dependencies are inferred from the claim text.