Methods of forming pillars for memory cells using sequential sidewall patterning
AssigneeSanDisk 3D LLC
InventorsRoy E. Scheuerlein, Christopher J. Petti, Yoichiro Tanaka
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AssigneeSanDisk 3D LLC
InventorsRoy E. Scheuerlein, Christopher J. Petti, Yoichiro Tanaka
Estimating the term…
The present invention provides apparatus, methods, and systems for fabricating memory structures methods of forming pillars for memory cells using sequential sidewall patterning. The invention includes forming first features from a first template layer disposed above a memory layer stack; forming first sidewall spacers adjacent the first features; forming second features that extend in a first direction in a mask layer by using the first sidewall spacers as a hardmask; depositing a second template layer on the mask layer; forming third features from the second template layer; forming second sidewall spacers adjacent the third features; and forming fourth features that extend in a second direction in the mask layer by using the second sidewall spacers as a hardmask. Numerous additional aspects are disclosed.
A method of forming a mask for patterning a memory array, comprising:
A mask for patterning a memory array comprising:
A method of forming a mask for patterning a memory array, comprising:
A mask for patterning a memory array comprising:
Dependencies are inferred from the claim text.