Pressing apparatus for pressing heat sinks on a circuit board and pressing tool thereof
AssigneeWistron Corporation
InventorsChia-Ming Lee, Shou-Yuan Yang
Life of this patent
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AssigneeWistron Corporation
InventorsChia-Ming Lee, Shou-Yuan Yang
Estimating the term…
A pressing apparatus is adapted for pressing a plurality of heat sinks on a circuit board, and includes a frame body and a plurality of pressing tools. The frame body includes a platform configured for placement of the circuit board thereon, and a mounting frame disposed above and spaced apart from the platform. The pressing tools are disposed at respective positions on the mounting frame. Each of the pressing tools includes an axle component, a universal joint unit disposed at a bottom end of the axle component, and a pressing head connected to the universal joint unit. The axle component extends downwardly between the platform and the mounting frame, and is configured to be resiliently and vertically movable. The pressing head is adapted for contacting one of the heat sinks, and is rotatable about the axle component by virtue of the universal joint unit.
A pressing apparatus adapted for pressing a plurality of heat sinks on a circuit board, said pressing apparatus comprising:
A pressing tool adapted for use in a pressing apparatus including a frame body, said pressing tool being disposed at the frame body and being movable to press a heat sink on a circuit board, said pressing tool comprising:
Dependencies are inferred from the claim text.