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US 2011/0087359 A1Published application
Integrated circuits modeling manufacturing procedure and manufacturing system utilizing the same
AssigneeNanya Technology Corporation
InventorHui-Chen Yang
Life of this patent
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Abstract
An ICs modeling manufacturing procedure is disclosed. A first pattern is printed on a first surface of a printed circuit board (PCB). The first pattern includes a first barcode and a plurality of production codes. A plurality of elements are disposed on the first surface of the PCB. The PCB is heated to fix the elements on the first surface and secure the first pattern on the first surface of the PCB. When the first pattern is read, a first production information is obtained.
Claims20
An ICs modeling manufacturing procedure, comprising:
- printing a first pattern on a first surface of a printed circuit board (PCB), wherein the first pattern comprises a first barcode and a plurality of production codes;
- disposing a plurality of elements on the first surface;
- heating the PCB to fix the elements on the first surface and secure the first pattern on the first surface of the PCB, wherein when the first pattern is read, a first production information is obtained;
- reading the first pattern to generate a second pattern, wherein the second pattern comprises a second barcode and a plurality of processing codes;
- cutting the PCB;
- and
- collecting the cut small-sized PCBs.
4 more elements
An ICs modeling manufacturing system, comprising:
- a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface;
- a surface-mount technology (SMT) device printing a first pattern on the first surface of the PCB, disposing a plurality of elements on the first surface, and heating the PCB to fix the elements on the first surface and secure the first pattern on the first surface of the PCB, wherein the first pattern comprises a first barcode and a plurality of production codes and when the first pattern is read, a first production information is obtained;
- and
- a processing device reading the first pattern to generate a second pattern, cutting the PCB, and collecting the cut small-sized PCBs.
1 more element
Dependencies are inferred from the claim text.