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AssigneesSTMicroelectronics S.r.l., RJR Polymers, Inc.
InventorsCraig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
Estimating the term…
A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assembly.
A method of designing a desired modular package assembly in accordance with a modular design, comprising:
A non-transitory computer-readable storage medium with an executable program stored thereon, wherein the program instructs a microprocessor to perform a method for designing a modular package assembly comprising:
Dependencies are inferred from the claim text.