Modular low stress package technology

A method of designing a desired modular package assembly in accordance with a modular design, comprising:

• determining a package outline of a modular package assembly by receiving package outline user input design data at a design tool;
• determining seating plane and overall package length characteristics of the modular package assembly by receiving seating plane and package length user input design data at the design tool;
• the design tool calculating minimum package height of the modular package assembly from the received seating plane and package length user input design data;
• designing the dimensions and the configuration of one or more subassemblies of the modular package assembly by receiving subassembly user input design data at the design tool, each subassembly of the one or more subassemblies comprising a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element;
• defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, and the minimum package height of the modular package assembly and the dimensions and configuration of the designed one or more subassemblies, wherein the mechanical layers comprise a fastening element, a subassembly support element having one or more subassembly receiving sections of defined dimension and configuration each comprising a cross member and configured to receive the one or more subassemblies, and an electrical connections element configured to accommodate electrical connections of the one or more subassemblies;
• defining an adhesive deposition strategy to join together the plurality of mechanical layers of the protective modular package cover;
• designing the protective modular package cover in accordance with the dimensions and configuration of the plurality of mechanical layers of the protective modular package cover;
• and
• incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assembly.