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US 2011/0086988 A1Published application
Composition comprising polyols
AssigneeEvonik Degussa GmbH
InventorsRudolfus Antonius Theodorus Maria Van Benthem, Mark Martinus Maria Janssen, Jozef Johannes Catherina Jacobus Boonen
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Abstract
Heat curable resin compositions include at least one phenol-glyoxylate resin (PG resin) and at least one polyol, wherein preferably the ratio of OH from the polyol to COOH from the PG resin is from 0.01:1 to 1:1.2.
Claims13
A heat curable resin composition comprising at least one phenol-glyoxylate resin (PG resin) and at least one polyol.
Dependencies are inferred from the claim text.