Curable composition
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsKeita Kobayashi, Kimihiko Yoda, Jun Watanabe
Life of this patent
Estimating the term…
Abstract
To provide a curable composition which is quickly cured, with which objects to be bonded can be sufficiently bonded even if gaps are formed between the objects, if the size of the gaps is at a level of at most 100 μm. A curable composition which comprises at least one organic peroxide, an accelerator which reacts with the organic peroxide to accelerate polymerization of monomers, a monofunctional (meth)acrylate and a multifunctional (meth)acrylate, wherein the organic peroxide is encapsulated in microcapsules. Preferably the above curable composition, wherein the monofunctional (meth)acrylate contains a (meth)acrylate having a carboxylic group and a (meth)acrylate having an alicyclic hydrocarbon.
Claims13
A curable composition which comprises (a) an organic peroxide encapsulated in microcapsules, (b) an accelerator, (c) a monofunctional (meth)acrylate and (d) a multifunctional (meth)acrylate.
Dependencies are inferred from the claim text.