Cyclic olefin compositions for temporary wafer bonding
AssigneeBrewer Science Inc.
InventorsWenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
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Abstract
New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
Claims14
A composition useful for bonding two substrates together, said composition comprising a cycloolefin copolymer and an ingredient dissolved or dispersed in a solvent system, said ingredient being selected from the group consisting of tackifier resins, low molecular weight cycloolefin copolymers, and mixtures thereof.
Dependencies are inferred from the claim text.