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US 2011/0086580 A1Published application
Wafer back side grinding process
AssigneeNanya Technology Corporation
InventorJen-Chung Chen
Life of this patent
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Abstract
A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. A first back side of the first semiconductor wafer is grinded by using the second assembly as a carrier. Thereafter, a second back side of the second semiconductor wafer is grinded.
Claims18
A wafer back side grinding process, comprising:
- providing a workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer, wherein the first and second assemblies are bonded together with at least one hot melt adhesive layer between active sides of the first and second semiconductor wafers;
- grinding a back side of the first semiconductor wafer by using the second assembly as a carrier;
- and
- grinding a back side of the second semiconductor wafer.
1 more element
A wafer back side grinding process, comprising:
- providing a workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer, wherein the first and second assemblies are bonded together with at least one hot melt adhesive layer between active sides of the first and second semiconductor wafers;
- loading the workpiece into a wafer grinder;
- grinding a back side of the first semiconductor wafer by using the second assembly as a carrier;
- grinding a back side of the second semiconductor wafer;
- and
- unloading the workpiece from the wafer grinder.
3 more elements
Dependencies are inferred from the claim text.