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US 2011/0086558 A1Published application
Electrical contact with improved material and method manufacturing the same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsChih-Pi Cheng, Cheng-Ching Chien, Jia-Hau Liu, Been-Yang Liaw
Life of this patent
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Abstract
An electrical contact material includes a base material, a first number of plating layers forming a contact section and a second number of plating layers forming a soldering section, respectively. The second number of plating layers is provided on the base material and includes a Ni-plating layer directly on the base material and an organic antioxidant-plating layer on said Ni-plating layer.
Claims12
An electrical contact comprising:
- a base material;
- and
- a first plurality of plating layers forming a contact section and a second plurality of plating layers forming a soldering section, respectively, said first plurality of plating layers and said second plurality of plating layers being provided on the base material;
- said first plurality of plating layers including a Ni-plating layer directly on the base material and an Au-plating layer on the Ni-plating layer, said second plurality of plating layers including a Ni-plating layer directly on the base material and an organic antioxidant-plating layer on said Ni-plating layer.
1 more element
A process for manufacturing an electrical contact, comprising:
- a loading material step to load an electrical contact with a base material;
- an alkalidipping step for wiping off the dirty on the base material;
- a pickling step for cleaning the oxidant on the base material;
- a plating step comprising a Ni plating step on the base material and an organic antioxidant plating step after the Ni plating step;
- and
- an unloading step to unload the electrical contact.
3 more elements
In a combination, comprising:
- a conductive contact including an upper contacting section, a middle body and a lower soldering section,
- each of the upper contacting section, the middle body and the lower soldering section defining two opposite faces each coated with an inner Ni layer and an outer organic antioxidant layer, wherein the upper contacting section is configured to contact an electrode of an electronic package while the soldering section is configured to contact a solder ball which is adapted to be melted for mounting a printed circuit board.
Dependencies are inferred from the claim text.