Modular low stress package technology
AssigneesSTMicroelectronics S.r.l., RJR Polymers, Inc.
InventorsCraig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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AssigneesSTMicroelectronics S.r.l., RJR Polymers, Inc.
InventorsCraig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
Estimating the term…
A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.
A method of manufacturing a protected package assembly, comprising:
Dependencies are inferred from the claim text.