Assembly of semiconductor chips/wafers
OwnerYacine Felk, Hamed Chaabouni +1inventors
InventorsYacine Felk, Hamed Chaabouni, Alexis Farcy
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Abstract
A method for assembling a first semiconductor chip provided with pads on a second semiconductor chip or wafer provided with pads, comprising covering the chip(s) with a dielectric, superposing the two chips, the pads being arranged substantially opposite to each other, and applying a voltage difference between the pads of the first and second chips to cause a breakdown of the dielectric and a diffusion of the conductor forming the pads into the broken down areas, whereby a conductive path forms between the opposite pads.
Claims3
A method for assembling a first semiconductor chip (P2) provided with pads (5B) on a second semiconductor chip or wafer (P1) provided with pads (5A), comprising:
- covering the chip(s) with silicon oxide,
- superposing the two chips, the pads being arranged substantially in front of one another, and
- applying a voltage difference between the pads of the first and second chips to cause a breakdown of the dielectric and a diffusion of the conductor forming the pads into the broken down areas, whereby a conductive path forms between the opposite pads.
2 The method of claim 1, wherein the pads are made of copper.
Dependencies are inferred from the claim text.