Method for making an optical device with integrated optoelectronic components
AssigneeCommiss. A L'energie Atom. Et Aux Energ. Alterna.
InventorSebastien Bolis
Life of this patent
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Abstract
A method for making an optical device with integrated optoelectronic components, including a) making a protective structure including a support in which at least one blind hole is made, an optical element being positioned in the blind hole, b) attaching the support to a substrate including the integrated optoelectronic components, the blind hole forming a cavity in which the optical element faces one of the optoelectronic components, c) achieving thinning of the substrate and making electric connections through the substrate, and d) making an aperture through the bottom wall of the blind hole, uncovering at least one portion of the optical field of the optical element.
Claims22
1-21. (canceled)
A method for making an optical device with integrated optoelectronic components, comprising:
- a) making a protective structure comprising at least one support in which at least one blind hole is made, at least one optical element being positioned in the blind hole and attached to at least one wall of the blind hole;
- b) attaching the support to a substrate comprising the integrated optoelectronic components, the blind hole forming a cavity in which the optical element faces one of the optoelectronic components;
- c) performing thinning of the substrate and making electric connections through the substrate;
- and
- d) making at least one aperture through the bottom wall of the blind hole, uncovering at least one portion of the optical field of the optical element.
The method according to claim 21, the a) making the protective structure comprises:
- making a first stack including a first layer and a second layer comprising at least one material forming the optical element;
- etching the second layer, at least one remaining portion of the second layer forming the optical element;
- depositing an adhesive bonding interface on at least the optical element;
- making a second stack including a third mechanical layer and a fourth layer;
- etching at least one hole through the fourth layer;
- attaching the first and second stacks, the third layer being positioned against the adhesive bonding interface, the optical element being positioned in the hole etched through the fourth layer;
- and removing the first layer.
The method according to claim 21, the a) making the protective structure comprises:
- making the support in which the blind hole is made,
- positioning and attaching the optical element in the blind hole via at least one attachment material positioned beforehand at least on one wall of the blind hole and/or on the optical element.
The method according to claim 21, further comprising, between the a) making the protective structure and the b) attaching the support to a substrate, depositing at least one layer, at least partly opaque in a range of operating wavelengths of the optoelectronic component and/or electrically conducting on at least one part of the walls of the blind hole and/or at least one part of the surface of the support attached to the substrate, forming an optical and/or electromagnetic protection.
The method according to claim 21, further comprising, during the a) making, making an optical and/or electromagnetic protection between the support and the optical element.
The method according to claim 21, the support being formed by a single layer, the blind hole being obtained by etching in the single layer.
The method according to claim 21, further comprising, after the d) making the aperture, depositing at least one layer at least partly opaque in a range of operating wavelengths of the optoelectronic component and/or electrically conducting on walls of a rear face of the support, opposite to the face of the support attached to the substrate.
The method according to claim 21, further comprising, after the d) making the aperture, transferring at least one optical stack including at least one optical element on a rear face of the support, opposite to the face of the support attached to the substrate, in an optical field of the optoelectronic component positioned in the cavity.
Dependencies are inferred from the claim text.