Method and system of manufacturing semiconductor device

A method for manufacturing a semiconductor device comprising:

• forming a positive type resist film on a substrate;
• exposing a portion of the resist film, the portion being formed on a peripheral area of the substrate, the peripheral area surrounding a device area of the substrate, the device area including a center portion of the substrate;
• after the exposing the peripheral area, performing a first heating process to heat the resist film;
• after the first heating process, performing a first developing process to develop the resist film;
• after the first developing process, exposing another portion of the resist film, the another portion being formed on the device area;
• after the exposing the device area, performing a second heating process to heat the resist film;
• and
• after the second heating process, performing a second developing process to develop the resist film.

A method for manufacturing a semiconductor device comprising:

• forming a resist film on a substrate;
• exposing a part of the resist film;
• after the exposing, cooling the resist film;
• after the cooling, heating the resist film;
• and
• after the heating, developing the resist film.

A system of manufacturing a semiconductor device comprising:

• a film forming unit configured to form a resist film on a substrate;
• a first exposing unit configured to expose a portion of the resist film, the portion being formed on a device area of the substrate, the device area including a center portion of the substrate;
• a first heating unit configured to heat the resist film;
• a second exposing unit configured to expose another portion of the resist film, the another portion being formed on a peripheral area of the substrate, and the peripheral area surrounding the device area;
• a second heating unit configured to heat the resist film;
• and
• a developing unit configured to develop the resist film,
• the first exposing unit and the first heating unit being installed in a first apparatus, and
• the second exposing unit and the second heating unit being installed in a second apparatus.

A system of manufacturing a semiconductor device comprising:

• a film forming unit configured to form a resist film on a substrate;
• an exposing unit configured to expose a portion of the resist film, the portion being formed on a device area of the substrate, the device area including a center portion of the substrate;
• a heating unit configured to heat the resist film;
• a developing unit configured to develop the resist film;
• and
• a cooling apparatus configured to cool the resist film,
• the cooling apparatus cooling the resist film at least after the exposing unit exposes the resist film and before the heating unit heats the resist film.