Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

A photosensitive resin composition comprising:

• (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group represented by the following formula (I), 5-55 parts by weight of a divalent group represented by the following formula (II) and 15-50 parts by weight of a divalent group represented by the following formula (III),
• (B) a photopolymerizing compound, and
• (C) a photopolymerization initiator.
• [In formula (I), formula (II) and formula (III), R1, R3 and R5 each independently represent hydrogen or a methyl group, R2 represents C1-3 alkyl, C1-3 alkoxy, hydroxyl, amino or a halogen atom, R4 represents an optionally substituted alicyclic hydrocarbon, optionally substituted aromatic hydrocarbon or optionally substituted heterocyclic group, m represents an integer of 0-5, and when m is 2-5, the multiple R2 groups may be the same or different.]