Bonding apparatus
AssigneeEpl Composite Solutions Limited
InventorsDavid Ronald Alfred Chambers, Nigel Andrew Finney, Stuart Ward, Matthew Richard Turner
Life of this patent
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Abstract
Bonding apparatus (10) for bonding a thermoplastic first material (12) to a second material (14) includes a heater arrangement (22) for heating a bonding surface (16) of the first material (12) to melt the bonding surface (16), and moving means (30) for moving the first and second materials (12, 14) together to a bonded condition.
Claims36
A bonding apparatus for bonding a thermoplastic first material to a second material, the apparatus including a heater arrangement for heating a bonding surface of the first material to melt the bonding surface, and moving means for moving the first and second materials together to a bonded condition.
A process for bonding a thermoplastic first material to a second material, the process including the steps of applying heat to a surface of the first material to melt the surface and moving the first material and the second material together to a bonded condition.
36-39. (canceled)
Dependencies are inferred from the claim text.