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US 2011/0086231 A1Published application
Dispersion for applying a metal layer
AssigneeBASF SE
InventorsRene Lochtman, Norbert Wagner, Jürgen Kaczun, Jürgen Pfister
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Abstract
The present invention relates to a dispersion for the application of a metal layer on a non-electrically-conductive substrate comprising an organic binder component, a metal component, and also a solvent component. The invention further relates to processes for the production of the dispersion, processes for the production of a non-structured or structured metal layer with the aid of the dispersion, and also to the resultant substrate surfaces and their use.
Claims15
1-20. (canceled)
A dispersion for the application of a metal layer on a non-electrically-conductive substrate, comprising
- an organic binder component A,
- a metal component B, and
- a solvent component C,
- wherein the organic binder component A consists essentially of
- A1 a polyvinyl chloride copolymer having hydroxy groups and
- A2 a polyurethane having hydroxy groups, and
- wherein the oxidation state of the metal is 0 and wherein the surface of the metal can have a coating.
4 more elements
Dependencies are inferred from the claim text.