Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
AssigneeHitachi Metals, Ltd.
InventorHideko Fukushima
Life of this patent
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Abstract
A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK a more and less than 4×10−6/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10×10−6/K or less, respectively, in a direction perpendicular to the extrusion direction.
Claims14
A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal;
- said composite material having such anisotropy that said thermal conductivity and said thermal expansion coefficient are 250 W/mK or more and less than 4×10−6/K, respectively, in an extrusion direction;
- and that said thermal conductivity and said thermal expansion coefficient are 150 W/mK or more and 10×10−6/K or less;
- respectively, in a direction perpendicular to said extrusion direction.
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Dependencies are inferred from the claim text.