Barrier coating with reduced process time

A method of encapsulating an electronic device on a substrate, the method comprising:

• depositing substantially organic materials at a selected deposition rate greater than 25 nm/min, wherein the substantially organic materials form part of a barrier encapsulating one or more of the electronic device and the substrate.

A method of depositing a barrier over an electronic device, the method comprising:

• forming the barrier in 20 minutes or less, wherein the barrier comprises one or more zones comprising substantially inorganic and substantially organic materials and substantially protects the light emitting structure from adverse environmental conditions.

A barrier consisting of:

• one or more organic zones of organic materials deposited in 20 minutes or less, wherein the barrier is configured to substantially protect an electronic device from environmental conditions.