Apparatus and Method for Vertically-Structured Passive Components
AssigneeWintec Industries, Inc.
InventorKong-Chen Chen
Life of this patent
Estimating the term…
Abstract
A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.
Claims34
A discrete electronic device for connection to a target platform positioned substantially in a first plane, comprising:
- a first surface substantially parallel to the first plane, the first surface including a first contact region;
- a second surface substantially parallel to the first plane, the second surface including a second contact region;
- a structure coupled to the first contact region and to the second contact region, the structure electrically connecting the first contact region and the second contact region to implement one or more passive components and the structure substantially perpendicular to the first plane;
- and
- an insulation sidewall affixed to an exterior surface of the structure, the insulation sidewall at least partially encirculating at least one of the first contact region and the second contact region.
An electronic package comprising:
- a substrate positioned substantially in a first plane, the substrate including an integrated circuit device and a plurality of pad contacts coupled to the integrated circuit device;
- a plurality of passive components, wherein the passive component comprising:
- a first surface including a first contact region, the first surface substantially parallel to the first plane;
- a second surface including a second contact region, the second surface substantially parallel to the first plane;
- a structure coupled to the first contact region and to the second contact region and substantially perpendicular to the first plane, the structure electrically connecting the first contact region and the second contact region to implement one or more passive functions;
- and
- a plurality of external contact regions for external access;
- wherein the first contact of the passive component is coupled to the pad contact;
- and
- the second contact region of the passive component is coupled to the external contact region.
A method for assembling an electronic device comprising the steps of:
- identifying a target platform including a target contact region, the target platform positioned substantially in a first plane;
- identifying an electronic substrate positioned substantially in a second plane, the electronic substrate including a substrate contact region, a component comprising an electronic device and a pad contact region, wherein the substrate contact region is coupled to the pad contact region;
- and
- a vertical passive comprising a first surface including a first contact region, the first surface substantially parallel to the second plane, a second surface including a second contact region, the second surface substantially parallel to the second plane and a structure coupled to the first contact region and to the second contact region, the structure substantially perpendicular to the first plane and to the second plane and electrically connecting the first contact region and the second contact region to implement one or more passive functions;
- and
- coupling the target contact region to the first contact region;
- coupling the substrate contact region to the second contact region;
- aligning the substrate contact region to the target contact region;
- and
- coupling the electronic substrate to the target platform.
Dependencies are inferred from the claim text.