Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias

An electronic module comprising:

• a stack of integrated circuit chips comprising a first integrated circuit chip layer having a first electrical connection and a second integrated circuit chip layer having a second electrical connection,
• a heat spreader disposed between the first integrated circuit chip layer and the second integrated chip layer and having a first major surface and a second major surface,
• an aperture defined through the heat spreader having an interior surface,
• a dielectric layer disposed on the interior surface of the aperture to define an insulated through-hole via,
• an electrically conductive member disposed in the via and having a first terminal end electrically accessible on the first major surface and a second terminal end electrically accessible on the second major surface, and,
• the first electrical connection and the second electrical connection in electrical communication by means of the electrically conductive member.

A method for making a heat spreader having a vertical electrically conductive member comprising the steps of:

• providing a heat spreader blank having a first major heat spreader blank surface and a second major heat spreader blank surface,
• removing a portion of the heat spreader blank on the first major heat spreader blank surface to a predetermined depth to define a column and a perimeter volume,
• filling the perimeter volume with a dielectric material, and,
• removing a predetermined portion of the second major heat spreader surface of the heat spreader blank to define an electrically conductive member that is electrically insulated from the heat spreader blank.

A method for making a heat spreader having a vertical electrically conductive member comprising the steps of:

• defining an electrically conductive member having an outer diameter on a substrate,
• providing a heat spreader blank,
• defining an aperture having an inner diameter greater than the outer diameter of the electrically conductive member in the heat spreader blank,
• bonding the substrate to the heat spreader blank whereby the electrically conductive member is substantially centered within the aperture and defines a perimeter volume,
• filling the perimeter volume with a dielectric,
• removing the substrate to expose a portion of the electrically conductive member.