Camera Module and Manufacturing Method Thereof
AssigneeLG Innotek Co., Ltd.
InventorYounback Jung
Life of this patent
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Abstract
Disclosed is a camera module and a manufacturing method thereof, wherein the camera module includes a PCB (Printed Circuit Board) mounted with an image sensor, a holder fixed at the PCB, with one side formed with an optical transmission hole and the other side being opened, one or more lenses to be inserted into the holder, and a fixture ring to be inserted into the holder and fixed at an image sensor for fixing one or more lenses, whereby occurrence of defect caused by introduction of foreign objects during assembly of camera module can be minimized, and structure of camera module can be simplified to facilitate the assembling process and to reduce the assembling time.
Claims19
A camera module comprising:
- a PCB (Printed Circuit Board) mounted with an image sensor;
- a holder fixed at the PCB, with one side formed with an optical transmission hole and the other side being opened;
- one or more lenses to be inserted into the holder;
- and a fixture ring to be inserted into the holder and fixed at an image sensor for fixing one or more lenses.
A manufacturing method of a camera module, the method comprising:
- inserting one or more lenses into a lens mounting unit of a holder;
- fixing a lens by inserting a fixture ring into a fixture ring mounting unit of the holder;
- and fixing the fixture ring at the image sensor and fixing the holder at a PCB (Printed Circuit Board).
Dependencies are inferred from the claim text.