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US 2011/0084787 A1Published application
Photosensitive resin composition, metal-base-containing circuit board production method employing the photosensitive resin composition, and metal-base-containing circuit board
AssigneeNitto Denko Corporation
InventorsHirofumi Fujii, Katsutoshi Hirashima, Yasushi Tamura
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Abstract
A photosensitive resin composition which is capable of reducing stress occurring due to thermal history, such as a heat treatment, a metal-base-containing circuit board production method which suppresses the warpage of a circuit board by employing the photosensitive resin composition and a metal-base-containing circuit board. The photosensitive resin composition comprises a polyamide acid, a 1,4-dihydropyridine derivative and an amide compound.
Claims18
A photosensitive resin composition comprising:
- (A) a polyamide acid;
- (B) a 1,4-dihydropyridine derivative represented by the following general formula (1):
- wherein Ar is a monovalent aromatic hydrocarbon group having a nitro group at its ortho position;
- R1 and R2, which may be the same or different, are each a hydrogen atom or a C1-4 alkyl group;
- R3 and R4, which may be the same or different, are each a C1-4 alkyl group or a C1-4 alkoxy group;
- and R5 is a hydrogen atom or a C1-4 alkyl group;
- and
- (C) an amide compound represented by the following general formula (2):
- wherein R6 and R7 are each a methyl group;
- and R8 is a C1-4 alkyl group.
7 more elements
A metal-base-containing circuit board production method comprising:
- forming a first coating film of a photosensitive resin composition on a metal base;
- irradiating the first coating film with activation radiation via a first photomask having a first predetermined pattern for exposure, and heat-treating the first coating film at 150° C. to 200° C.;
- removing an unexposed portion of the first coating film with a developing liquid to form a first negative pattern, and heat-treating a remaining portion of the first coating film at 250° C. to 450° C., whereby the remaining portion of the first coating film is imidized to form a polyimide insulative layer of the first predetermined pattern on the metal base;
- forming a conductor layer of a predetermined wiring circuit pattern on the insulative layer;
- forming a second coating film of the photosensitive resin composition over the conductor layer;
- irradiating the second coating film with activation radiation via a second photomask having a second predetermined pattern for exposure, and heat-treating the second coating film at 150° C. to 200° C.;
- and
- removing an unexposed portion of the second coating film with the developing liquid to form a second negative pattern, and heat-treating a remaining portion of the second coating film at 250° C. to 450° C., whereby the remaining portion of the second coating film is imidized to form a polyimide cover layer of the second predetermined pattern over the conductor layer;
- wherein the photosensitive resin composition comprises:
- (A) a polyamide acid;
- (B) a 1,4-dihydropyridine derivative represented by the following general formula (1):
- wherein Ar is a monovalent aromatic hydrocarbon group having a nitro group at its ortho position;
- R1 and R2, which may be the same or different, are each a hydrogen atom or a C1-4 alkyl group;
- R3 and R4, which may be the same or different, are each a C1-4 alkyl group or a C1-4 alkoxy group;
- and R5 is a hydrogen atom or a C1-4 alkyl group;
- and
- (C) an amide compound represented by the following general formula (2):
- wherein R6 and R7 are each a methyl group;
- and R8 is a C1-4 alkyl group.
16 more elements
Dependencies are inferred from the claim text.