Test apparatus for electronic device package and method for testing electronic device package

A method for testing an electronic device package, comprising:

• providing a first electronic device package to be tested having a plurality of first external terminals arranged in a first terminal configuration;
• providing a test socket having a first portion and a second portion overlying the first portion, wherein the first portion has a recess for receiving an electronic device package to be tested;
• disposing an interchangeable insert board between the first portion and the second portion, wherein the interchangeable insert board is partially extended on the recess and comprises:
• a plurality of first contact pads arranged in a first pad configuration compatible with the first terminal configuration and facing the recess;
• a plurality of second contact pads arranged in a second pad configuration and disposed between the first portion and the second portion of the test socket;
• and
• a plurality of trace layers each electrically connecting one of the first contact pads to one of the second contact pads, respectively;
• providing a plurality of contact pins each penetrating through the second portion of the test socket and electrically connected to one of the second contact pads of the interchangeable insert board, wherein the contact pins are arranged in a pin configuration, and wherein the second pad configuration is compatible with the pin configuration;
• and
• disposing the first electronic device package into the recess to make each of the first external terminals electrically connect to one of the first contact pads, respectively.