Hybrid chip-on-heatsink device and methods
AssigneeGeneral Led, Inc., A Delaware Corporation
InventorsWilliam R. Ratcliffe, Jianbiao Pan
Life of this patent
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Abstract
A hybrid chip-on-heatsink device comprises at least one LED die, at least one printed circuit board (PCB), and a thermally conductive substrate or heatsink. The LED die is physically and thermally coupled to the thermally conductive substrate. The PCB is physically coupled to the thermally conductive substrate. The LED die is electrically coupled to the PCB. The thermally conductive substrate acts as a spreader and as a heatsink, whereby heat is efficiently dissipated away from the LED die. The PCB may optionally contain other electrical components, and circuitry to create a “smart” LED package or light engine.
Claims18
A hybrid chip-on-heatsink device, comprising:
- at least one LED die;
- at least one PCB;
- and
- a thermally conductive substrate,
- the at least one LED die being physically and thermally coupled to the thermally conductive substrate,
- the at least one PCB being physically coupled to the thermally conductive substrate,
- the at least one LED die being electrically coupled to a component of the at least one PCB, and
- the thermally conductive substrate acting as a heat spreader and as a heatsink, whereby heat is efficiently dissipated away from the at least one LED die.
A method of fabricating a hybrid chip-on-heatsink device, comprising:
- providing at least one LED die;
- providing at least one PCB;
- providing a thermally conductive substrate;
- physically coupling the at least one LED die to the thermally conductive substrate;
- physically coupling the at least one PCB to the thermally conductive substrate;
- and
- electrically coupling the at least one LED die to the at least one PCB,
- whereby the thermally conductive substrate is capable of acting as a heat spreader and as a heatsink, and
- whereby heat is capable of being efficiently dissipated away from the at least one LED die.
A method of using a hybrid chip-on-heatsink device, comprising at least one bare LED die, at least one PCB, and a thermally conductive substrate (heatsink) including:
- physically and thermally coupling the at least one bare LED die to a thermally conductive substrate;
- physically coupling the at least one PCB to the thermally conductive substrate;
- electrically coupling the at least one bare LED die to the at least one PCB;
- electrically energizing the at least one bare LED die, thereby generating light and heat;
- spreading and sinking the heat in the thermally conductive substrate, whereby the heat is efficiently dissipated away from the at least one bare LED die.
Dependencies are inferred from the claim text.