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US 2011/0084579 A1Published application
Housing of electronic device and manufacturing methord thereof
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHUN-YUAN CHANG
Life of this patent
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Abstract
A housing includes a metal cover defining an opening and a patched member adhered to the cover to patch the opening. The patched member is formed by injecting resin into the opening of the cover in an injection mold for in-mold-decoration. A film is attached to an outer surface of the patched member.
Claims20
A housing for an electronic device, the housing comprising:
- a cover made of a first material, the cover defining an opening;
- and
- a patched member made of a second material, wherein the patched member is adhered to the cover to patch the opening;
- wherein the patched member comprises a film attached to an outer surface of the patch member.
1 more element
A method for manufacturing a housing of an electronic device, the method comprising:
- providing a cover defining an opening;
- providing a film;
- processing the film by hot pressing process, according to the shape of the opening of the metal cover;
- cutting the film according to the size of the opening of the cover;
- positioning the film and the cover in a mold, with the film positioned corresponding to the opening of the cover;
- closing the mold and injecting molten resin into the mold to form a plastic article to patch the opening;
- and
- opening the mold to retrieve the housing.
5 more elements
A method for manufacturing a housing of an electronic device, the method comprising:
- providing a cover defining an opening;
- providing a continuous film;
- providing a mold;
- transporting the film into the mold;
- positioning the cover in the mold, with the film positioned at the opening of the cover;
- closing the mold and injecting molten resin into the mold to form a plastic article to patch the opening;
- and
- opening the mold to retrieve the housing.
5 more elements
Dependencies are inferred from the claim text.