Thermosetting die-bonding film
OwnerYuichiro Shishido, Naohide Takamotoinventors
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Abstract
An object thereof is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, wherein the gel fraction in an organic component after thermal curing is performed by a heat treatment at 120° C. for 1 hour is 20% by weight or less, and the gel fraction in the organic component after thermal curing is performed by a heat treatment at 175° C. for 1 hour is in a range of 10 to 30% by weight.
Claims13
A thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, wherein
- the gel fraction in an organic component after thermal curing by a heat treatment at 120° C. for 1 hour is 20% by weight or less, and
- the gel fraction in the organic component after thermal curing by a heat treatment at 175° C. for 1 hour is in a range of 10 to 30% by weight.
A thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, comprising an uncured thermosetting die-bonding layer, wherein
- the gel fraction in an organic component of the thermosetting die-bonding layer after thermal curing by a heat treatment at 120° C. for 1 hour is 20% by weight or less, and
- the gel fraction in the organic component of the thermosetting die-bonding layer after thermal curing by a heat treatment at 175° C. for 1 hour is in a range of 10 to 30% by weight.
Dependencies are inferred from the claim text.