Indexing of electronic devices with multiple weight markers
AssigneeSTMicroelectronics S.r.I.
InventorsEmanuele Brenna, Antonio Di Franco
Life of this patent
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Abstract
A solution for indexing electronic devices includes corresponding electronic device including a die integrating an electronic circuit, the die having at least one index including a reference defining an ordered alignment of a plurality of locations on the die and a marker for defining a value of the index according to an arrangement of the marker with respect to the reference. In one embodiment, the marker includes a plurality of markers each one arranged at a selected one of the locations, the selected location of the marker defining a value of a digit associated with a corresponding power of a base higher than 2 within a number in a positional notation in the base representing the value of the index.
Claims15
An electronic device including a die integrating an electronic circuit, the die having at least one index including a reference defining an ordered alignment of a plurality of locations on the die and marker means for defining a value of the index according to an arrangement of the marker means with respect to the reference, wherein the marker means includes a plurality of markers each one arranged at a selected one of the locations, the selected location of the marker defining a value of a digit associated with a corresponding power of a base higher than 2 within a number in a positional notation in said base representing the value of the index.
A method for indexing electronic devices, the method including the steps of:
- integrating a plurality of electronic circuits into portions of a wafer for corresponding dice,
- forming at least one index on each die, each index including a reference defining an ordered alignment of a plurality of locations on the die and marker means for defining a value of the index according to an arrangement of the marker means with respect to the reference, the value of the index contributing to indicate a position of the die in the wafer, and
- cutting the dice for forming electronic devices,
- wherein the step of forming at least one index includes, for each index, forming a plurality of markers each one arranged at a selected one of the locations, the selected location of the marker defining a value of a digit associated with a corresponding power of a base higher than 2 within a number in a positional notation in said base representing the value of the index.
(canceled)
Dependencies are inferred from the claim text.