Thermosetting die-bonding film
OwnerYuichiro Shishido, Naohide Takamotoinventors
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Abstract
An object of the present invention is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, comprising at least an epoxy resin and a phenol resin as a thermosetting component, wherein the ratio of the number of moles of epoxy groups to the number of moles of phenolic hydroxyl groups in the thermosetting component is in a range of 1.5 to 6.
Claims12
A thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, comprising at least an epoxy resin and a phenol resin as a thermosetting component, wherein
- the ratio of the number of moles of epoxy groups in the thermosetting component to the number of moles of phenolic hydroxyl groups in the thermosetting component is in a range of 1.5 to 6.
A thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, comprising an uncured die-bonding layer, wherein the uncured die-bonding layer comprises at least an epoxy resin and a phenol resin as a thermosetting component, wherein the ratio of the number of moles of epoxy groups in the thermosetting component to the number of moles of phenolic hydroxyl groups in the thermosetting component is in a range of 1.5 to 6.
Dependencies are inferred from the claim text.