Device and interconnect in flip chip architecture

Abstract

The present invention discloses a device in flip chip architecture. The device comprises at least two integrated circuits, which are interconnected by a passive device. The integrated circuits are mounted on a base ground plate, and are each connected to the passive device via conductive elements. For the interconnection of the integrated circuits with the passive device, the device employs the structure of an inverted microstrip line, a suspended microstrip line, a covered microstrip line or a conventional microstrip line. Depending on the interconnection scheme, low transmission loss, low susceptibility to external interferences, easy alignment properties in the assembly process, a compact package size, a high reproducibility and/or low cost can be achieved.

Dependencies are inferred from the claim text.