Package-on-package system with via z-interconnections and method for manufacturing thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsTaewoo Lee, Sang-Ho Lee, SeungYun Ahn
Life of this patent
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Abstract
A method for manufacturing a package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.
Claims17
A method for manufacturing a package-on-package system comprising:
- providing an interposer substrate;
- mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto;
- forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die;
- and
- forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.
A method for manufacturing a package-on-package system comprising:
- providing a strip interposer substrate;
- mounting a strip base substrate under the strip interposer substrate and having first integrated circuit dies connected thereto;
- forming a strip encapsulant between the strip interposer substrate and the strip base substrate, the strip encapsulant encapsulating the first integrated circuit dies;
- and
- forming via z-interconnections extending through the strip encapsulant and one of the strip substrates to the other of the strip substrates.
A package-on-package system comprising:
- an interposer substrate;
- a first integrated circuit die;
- a base substrate under the interposer substrate and having the first integrated circuit die connected thereto;
- an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die;
- and
- a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.
Dependencies are inferred from the claim text.