Semiconductor package substrate and semiconductor device having the same

A semiconductor package substrate on which a semiconductor chip is to be mounted, comprising:

• a first surface having a first area;
• a second surface that is opposite to the first surface and has a second area which does not overlap the first area;
• a plurality of internal terminals provided in the first area;
• a plurality of external terminals provided in the second area;
• and
• a plurality of wirings each of which electrically connects an associated one of the internal terminals and an associated one of the external terminals, wherein
• each of the wirings includes a front surface wiring positioned relatively on the first surface side and extended in parallel to the first surface, a rear surface wiring positioned relatively on the second surface side and extended in parallel to the second surface and a contact that connects the front surface wiring and its corresponding rear side wiring,
• the wirings include a plurality of signal wirings, and
• the contacts included in the signal wirings are not disposed in the second area but disposed in a third area sandwiched between the first and second areas in the planar view.

A semiconductor device comprising:

• a semiconductor package substrate;
• and
• a semiconductor chip mounted on the semiconductor package substrate, wherein
• the semiconductor package substrate comprises:
• a first surface having a first area;
• a second surface that is opposite to the first surface and has a second area which does not overlap the first area;
• a plurality of internal terminals provided in the first area;
• a plurality of external terminals provided in the second area;
• and
• a plurality of wirings each of which electrically connects an associated one of the internal terminals and an associated one of the external terminals, wherein
• each of the wirings includes a front surface wiring positioned relatively on the first surface side and extended in parallel to the first surface, a rear surface wiring positioned relatively on the second surface side and extended in parallel to the second surface and a contact that connects the front surface wiring and its corresponding rear side wiring,
• the wirings include a plurality of signal wirings, and
• the contacts included in the signal wirings are not disposed in the second area but disposed in a third area sandwiched between the first and second areas in the planar view.