Semiconductor Structure
AssigneeUnited Microelectronics Corp.
InventorsHui-Min Wu, Bang-Chiang Lan, Ming-I Wang, Tzung-I Su, Chien-Hsin Huang, Chao-An Su, Tzung-Han Tan, Min Chen, Meng-Jia Lin
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AssigneeUnited Microelectronics Corp.
InventorsHui-Min Wu, Bang-Chiang Lan, Ming-I Wang, Tzung-I Su, Chien-Hsin Huang, Chao-An Su, Tzung-Han Tan, Min Chen, Meng-Jia Lin
Estimating the term…
A semiconductor structure is provided. The semiconductor structure includes a substrate, a dielectric layer, a pad structure and a protection structure. The dielectric layer is disposed on the substrate. The pad structure is disposed in the dielectric layer. The pad structure includes a plurality of first metal layers and a plurality of plugs which are electrically connected to each other vertically. There is no contact plug disposed between the pad structure and the substrate. The protection structure is disposed in the dielectric layer and encompasses the pad structure.
A semiconductor structure, comprising:
A semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.