Chip Design with Robust Corner Bumps
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsien-Wei Chen
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Abstract
An integrated circuit structure includes a semiconductor chip, which includes a corner, a side, and a center. The semiconductor chip further includes a plurality of bump pad structures distributed on a major surface of a substrate; a first region of the substrate having formed thereon a first bump pad structure having a first number of supporting metal pads associated with it; and a second region of the substrate having formed thereon a second bump structure having a second number of supported metal pads associated with it, the second number being greater than the first number.
Claims20
An integrated circuit comprising:
- a plurality of bump pad structures distributed on a major surface of a substrate;
- a first region of the substrate having formed thereon a first bump pad structure having a first number of supporting metal pads associated with it;
- and
- a second region of the substrate having formed thereon a second bump pad structure having a second number of supported metal pads associated with it, the second number being greater than the first number.
An integrated circuit comprising:
- a corner;
- an edge;
- a center;
- a first bump pad structure closest to the corner, relative other bump pad structures, and having a first pad structure;
- a second bump pad structure closest to the edge, relative other bump pad structures, and having a second pad structure, different from the first pad structure;
- and
- a third bump pad structure closest to the center, relative other bump pad structures, and having a third pad structure, different from the first and second pad structures.
An integrated circuit comprising:
- a substrate having a first region subject to a first stress and a second region subject to a second, higher stress;
- a plurality of bump pads formed on the substrate, the plurality of bump pads including:
- a first bump pad having a first stress ameliorating structure formed in the first region;
- and
- a second bump pad having a second stress ameliorating structure, different from the first stress ameliorating structure, formed in the second region.
Dependencies are inferred from the claim text.