Semiconductor device and manufacturing method thereof
AssigneeFujitsu Limited
InventorDaisuke MIZUTANI
Life of this patent
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Abstract
A semiconductor device includes a first circuit base member including a surface having multiple first electrodes formed thereon, a second circuit base member being provided above the first circuit base member and having first through holes and second through holes formed respectively above the first electrodes, a semiconductor package provided above the second circuit base member, and multiple first bumps provided inside the first through holes and the second through holes to connect the first electrodes to the semiconductor package.
Claims15
A semiconductor device comprising:
- a first circuit base member including a surface on which a plurality of first electrodes are formed;
- a second circuit base member being provided over the first circuit base member and including a first through hole and a second through hole formed respectively over the plurality of first electrodes;
- a semiconductor component provided over the second circuit base member and including a surface on which a plurality of second electrodes are formed;
- and
- a plurality of first bumps provided in the first through hole and the second through hole and connecting the first electrodes to the second electrodes.
A method of manufacturing a semiconductor device comprising:
- disposing a second circuit base member including a first through hole and a second though hole over a first circuit base member including a surface on which a plurality of first electrodes are formed;
- inserting a plurality of first bumps formed respectively on a plurality of second electrodes on a semiconductor component into the first through hole and the second through hole, thereby bringing the plurality of first bumps into contact with the plurality of first electrodes on the first circuit base member;
- and
- heating and fusing the first bumps, thereby bonding the first bumps to the first electrodes.
A method of manufacturing a semiconductor device comprising:
- fitting a plurality of first bumps provided on a first circuit base member respectively into a plurality of through holes in a second circuit base member;
- fitting a plurality of second bumps provided on a semiconductor component respectively into the plurality of through holes in the second circuit base member;
- and
- heating and fusing the first bumps and the second bumps, thereby electrically and mechanically connecting the first circuit base member to the semiconductor component through the first bumps and the second bumps.
Dependencies are inferred from the claim text.