Semiconductor package with integrated interference shielding and method of manufacture thereof
AssigneeSkyworks Solutions, Inc.
InventorsPatrick L. Welch, Yifan Guo
Life of this patent
Estimating the term…
Abstract
An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.
Claims21
A packaged semiconductor module having an integrated electromagnetic interference shield, the packaged semiconductor module comprising
- a substrate having a ground plane;
- an electronic device mounted on a surface of the substrate;
- a plurality of wirebond springs disposed about the electronic device and electrically coupled to the ground plane;
- a mold compound covering the electronic device and at least partially covering the plurality of wirebond springs;
- and
- a conductive layer disposed on a top surface of the mold compound and electrically coupled to at least some of the plurality of wirebond springs;
- wherein the plurality of wirebond springs, the conductive layer and the ground plane together comprise the integrated electromagnetic interference shield.
A wirebond spring formed of a continuous loop of wire comprising:
- a ball bond;
- a zone of inflection;
- a crest;
- a convex region extending between the zone of inflection and the crest;
- a sloping tail region;
- and
- a substantially flat region extending between the crest and the sloping tail region;
- wherein the zone of inflection is between the convex region and the ball bond.
A semiconductor module package having an integrated electromagnetic interference shield, the semiconductor module package comprising:
- a substrate;
- first and second metallized connection points disposed on a first surface of the substrate;
- a wirebond spring comprising a continuous wire extending between the first metallized connection point and the second metallized connection point;
- wherein the first wirebond spring comprises:
- a ball bond electrically connected to the first metallized connection point;
- a zone of inflection;
- a crest;
- a convex region extending between the zone of inflection and the crest;
- a substantially flat region proximate the crest;
- and
- a sloping tail region extending between the substantially flat region and the second metallized connection point.
A method of manufacturing a module having an integrated electromagnetic interference shield, the method comprising:
- connecting an electronic device to a substrate;
- providing metallizations on the substrate;
- forming a plurality of wirebond springs connected to the metallizations;
- performing a transfer molding process to encapsulate the electronic device in mold compound and to at least partially cover the plurality of wirebond springs with the mold compound;
- and
- disposing a conductive layer on a surface of the mold compound, the conductive layer electrically connected to at least some of the plurality of wirebond springs.
Dependencies are inferred from the claim text.