System for separating a diced semiconductor die from a die attach tape

A semiconductor package, comprising:

• a substrate;
• and
• at least one semiconductor die affixed to the substrate or another of the at least one semiconductor die, the at least one semiconductor die separated from a wafer by the steps of:
• (a) mounting the at least one semiconductor die on a tape along with the other semiconductor die on the wafer, the tape including first and second layers affixed to each other with a peeling strength;
• (b) dicing the at least one semiconductor die from the other semiconductor die;
• (c) situating the tape and at least one semiconductor die of the wafer on a support table with the at least one semiconductor die centered over an aperture including at least one chamfered sidewall;
• and
• (d) generating a suction force at an interface between an upper surface of the support table and the first layer of tape supported on the support table, the suction force exceeding the peeling strength to pull the first layer of tape away from at least one edge of the at least one semiconductor die positioned over the at least one chamfered sidewall.