Modular low stress package technology

A protective modular package assembly, comprising:

• one or more subassemblies, wherein each subassembly of the one or more subassemblies comprises a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element;
• a protective modular package cover, comprising:
• first and second fastening sections located at opposing first and second ends of the protective modular package cover, having one or more torque elements disposed on one or more of the first and second ends, and configured to fasten the protective modular package cover to a core;
• and
• one or more subassembly receiving sections disposed between the first and second fastening sections and each subassembly receiving section of the one or more subassembly receiving sections operable to receive a subassembly of the one or more subassemblies, wherein each subassembly receiving section of the one or more subassembly receiving sections comprises a cross member formed along the underside of the protective modular package cover;
• and
• an adhesive layer configured to affix the one or more subassemblies to respective subassembly receiving sections of the one or more subassembly receiving sections;
• wherein the one or more torque elements of the first and second fastening sections are configured to transfer a downward clamping force generated at the first or second fastening elements to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.