Semiconductor package with sectioned bonding wire scheme

A semiconductor package comprising:

• a carrier substrate having thereon at least one bond finger;
• a multiple-die stack comprising a first semiconductor die mounted on a top surface of the carrier substrate, and a second semiconductor die stacked on the first semiconductor die;
• at least one active bond pad disposed on the second semiconductor die;
• at least one dummy bond pad disposed on the second semiconductor die;
• a first bonding wire extending between the at least one active bond pad and the at least one dummy bond pad;
• a second bonding wire extending between the at least one dummy bond pad and the at least one bond finger;
• and
• a molding compound encapsulating at least the multiple-die stack.