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US 2011/0084373 A1Published application
Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsDaeSik Choi, BumJoon Hong, Sang-Ho Lee, Jong-Woo Ha, Soo-San Park
Life of this patent
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Abstract
A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.
Claims17
A method for manufacturing an integrated circuit package system comprising:
- providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side;
- and
- mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.
A method for manufacturing an integrated circuit package system comprising:
- providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side;
- and
- mounting a first portion of an offset package over the first integrated circuit and a second portion of the offset package overhanging the base substrate, the second portion coupled to the base substrate by a system interconnect.
An integrated circuit package system comprising:
- a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect on one side;
- and
- an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.
Dependencies are inferred from the claim text.