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US 2011/0084369 A1Published application
Device including a semiconductor chip and a carrier and fabrication method
AssigneeInfineon Technologies AG
InventorsHannes Eder, Ivan Nikitin, Manfred Schneegans, Jens Goerlich, Karsten Guth, Alexander Heinrich
Life of this patent
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Abstract
A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier.
Claims25
A method, comprising:
- providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip;
- placing the semiconductor chip over a carrier with the first surface facing the carrier and electrically conductive material being arranged between the semiconductor chip and the carrier;
- and
- applying heat to attach the semiconductor chip to the carrier.
1 more element
A method, comprising:
- applying metal particles to a surface of a semiconductor wafer at which semiconductor material is exposed;
- singulating the semiconductor wafer with the metal particles for obtaining a plurality of semiconductor chips;
- placing at least one of the plurality of semiconductor chips over a carrier with the metal particles facing the carrier;
- and
- heating the metal particles to attach the at least one semiconductor chip to the carrier.
2 more elements
A method, comprising:
- providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip;
- placing the semiconductor chip over a carrier with the first surface facing the carrier and metal particles being arranged between the semiconductor chip and the carrier, at least 50% of the metal particles having dimensions smaller than 100 nm;
- and
- sintering the metal particles.
1 more element
A device, comprising:
- a carrier;
- a sintered metal layer placed over the carrier;
- and
- a semiconductor chip placed over the sintered metal layer, the sintered metal layer being in direct contact with semiconductor material of the semiconductor chip.
1 more element
Dependencies are inferred from the claim text.